hardware:application_techniques_thermal_compound
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| hardware:application_techniques_thermal_compound [2026/02/02 21:35] – ↷ Page moved from internal:application_techniques_thermal_compound to hardware:application_techniques_thermal_compound thum | hardware:application_techniques_thermal_compound [2026/03/31 12:27] (current) – [TL;DR] thum | ||
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| TIM itself does not dissipate heat, it fills microscopic imperfections which result in air gaps on connecting surfaces, allowing for a much more efficient transfer of heat. | TIM itself does not dissipate heat, it fills microscopic imperfections which result in air gaps on connecting surfaces, allowing for a much more efficient transfer of heat. | ||
| + | ===== TL;DR ===== | ||
| + | |||
| + | :!: We conducted extensive testing on commonly available thermal pastes. | ||
| ===== Thermal Paste, Usage and Tipps ===== | ===== Thermal Paste, Usage and Tipps ===== | ||
hardware/application_techniques_thermal_compound.1770068157.txt.gz · Last modified: by thum
