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--- hardware:application_techniques_thermal_compound [2026/03/31 12:26] – thum
+++ hardware:application_techniques_thermal_compound [2026/04/22 14:28] (current) – reformatting article thum
@@ Line 1: / Line 1: @@
 ====== Introduction to Thermal Interface Materials and Best Practices ======
-Thermal Interface Materials (TIM) is used in the installation of any computer cooling solution to transfer heat from a processor to a heat sink in order to dissipate heat away from the device.
+Thermal Interface Materials (TIM) are used in the installation of any computer cooling solution to transfer heat from a processor to a heat sink. TIM itself does not dissipate heat — it fills microscopic imperfections which result in air gaps on connecting surfaces, allowing for a significantly more efficient transfer of heat.
-TIM itself does not dissipate heat, it fills microscopic imperfections which result in air gaps on connecting surfaces, allowing for a much more efficient transfer of heat.
 ===== TL;DR =====
-:!: We conducted extensive testing on commonly available thermal pastes.  Our findings revealed that **ARCTIC MX-7 is the highest-performing** product in this range, achieving temperatures that are 1 to 2 degrees lower than those achieved using ARCTIC MX-4, which we have used for many years.  It is also easy to use.  Our results are consistent with those of other specialised tests in this area.  We recommend using the 'X-Method' when applying it (see 'Recommended Method' below).  While other materials may yield slightly better results, they are all more difficult to use, and we consider them to be viable only in exceptional circumstances.
+<WRAP tip>
+We conducted extensive testing on commonly available thermal pastes. Our findings revealed that **ARCTIC MX-7 is the highest-performing** product in this range, achieving temperatures 1–2 °C lower than those achieved with ARCTIC MX-4, which we have used for many years. It is also easy to use, and our results are consistent with those of other specialised tests in this area.
-===== Thermal Paste, Usage and Tipps =====
+We recommend using the **X-Method** when applying it (see ''Recommended Method'' below). While other materials may yield slightly better results, they are all more difficult to use and more expensive — we consider them viable only in exceptional circumstances.
+</WRAP>
-Thermal paste is one of the most popular means to improve heat transfer.  It is not as thermally conductive as metal, so it is important not to use too much of it.  When this happens, the thermal paste acts more like an insulator than a means of improving thermal performance.
+===== Thermal Paste =====
+Thermal paste is one of the most popular means of improving heat transfer. It is not as thermally conductive as metal, so it is important not to use too much — excess paste acts more like an insulator than a thermal improver.
 ==== Applying Thermal Paste Correctly ====
-Applying thermal paste correctly minimizes air gaps between the CPU and heatsink for optimal cooling, but the amount and method matter to avoid insulation-like effects from excess paste.
+Applying thermal paste correctly minimises air gaps between the CPU and heatsink for optimal cooling. Both the amount and the method matter to avoid insulation-like effects from excess paste.
-Testing various techniques reveals clear winners for coverage, minimal bubbles, and real-world temperatures.
 ==== Key Findings ====
-We have tested various methods over the years.  The X-shape application delivered the best results, with excellent coverage across the CPU die and very few air bubbles, leading to the lowest full-load temperatures.  A smooth spread was nearly as effective, just 0.25°C warmer, while a rice-sized dot (or even a fun "happy face" variant) tied for third place.  Excess paste, like in larger dots or thick lines, performed worst as it squeezed out unevenly.
+We have tested various application methods over the years. The **X-shape application** delivered the best results, with excellent coverage across the CPU die and very few air bubbles, leading to the lowest full-load temperatures. A smooth spread was nearly as effective, just 0.25 °C warmer, whilst a rice-sized dot (or even a "happy face" variant) tied for third place. Excess paste — such as larger dots or thick lines — performed worst, as it squeezed out unevenly.
 ==== Recommended Method ====
-. Make sure that the CPU is clean and free from any old thermal paste. If there is, carefully remove it from the CPU lid with isopropyl alcohol and a microfibre cloth or lint-free paper towel, then leave it to dry before continuing.
+  - Make sure the CPU is clean and free from any old thermal paste. If necessary, carefully remove it with isopropyl alcohol and a microfibre cloth or lint-free paper towel, then leave it to dry before continuing.
+  - **Use a simple X-shape**: Draw two thin lines crossing at the centre, adjusting thickness slightly for larger CPUs to ensure full coverage. This method is quicker and more consistent than spreading (which risks tiny bubbles) and more reliable than a dot (which may not provide full coverage). It works reliably across CPU sizes, providing fuss-free, consistent cooling.
-. **Use a simple X-shape**: Draw two thin lines that cross at the centre, adjusting the thickness slightly for larger CPUs to ensure full coverage.  This method is quicker and more consistent than spreading, which risks tiny bubbles, and dots, which may not provide full coverage. It is ideal for everyday builds.  It works reliably across CPU sizes, providing fuss-free, reliable cooling.
 ==== Reusing Thermal Paste ====
-Reusing paste can also cause air bubbles to form.  If a problem occurs during the installation process and you have to remove the CPU cooler, you should completely clean off all paste as mentioned above, then try again with a fresh application.  If you absolutely need to reuse an application — while waiting for replacement paste, for example — you can, but keep in mind this is a short-term solution, and that we recommend a proper reapplication before long-term use of your CPU cooler.
+Reusing paste can cause air bubbles to form. If a problem occurs during installation and you need to remove the CPU cooler, clean off all paste completely and reapply fresh. If you absolutely must reuse an application in the short term — whilst waiting for replacement paste, for example — you can, but a proper reapplication is strongly recommended before long-term use.
 ==== How Often Should You Replace Thermal Paste? ====
-In most cases, you shouldn’t need to reapply thermal paste more than once every few years, though you should replace it if you remove your cooler for any reason.
+In most cases you should not need to reapply thermal paste more than once every few years, though you should always replace it whenever you remove your cooler for any reason. You may also want to reapply if CPU temperatures are rising and you can rule out other causes such as dust build-up. If in doubt, follow the thermal paste manufacturer's recommendations.
-You may also want to reapply thermal paste if you find that your CPU temperatures are rising and you can rule out other factors, such as dust build-up.
-If in doubt, consult the thermal paste manufacturer, and follow their recommendations.
 ===== Thermal Pads =====
-Thermal pads are soft, pre-cut sheets made from silicone or reinforced materials with conductive fillers like ceramic or fiberglass.
+Thermal pads are soft, pre-cut sheets made from silicone or reinforced materials with conductive fillers such as ceramic or fibreglass. They handle gaps up to several millimetres, provide electrical insulation, and are easy to apply without mess — ideal for VRAM or lower-heat components. Performance is moderate (typically 1–8 W/mK), but they excel in convenience over paste.
-They handle gaps up to several millimeters, provide electrical insulation, and are easy to apply without mess, ideal for VRAM or lower-heat components.
-Performance is moderate (typically 1-8 W/mK), but they excel in convenience over paste.
 ===== Phase Change Materials (PCM) =====
-PCMs, often in pad or sheet form like Thermal Grizzly PhaseSheet PTM, start solid at room temperature but soften above ~45°C to fill microscopic gaps like paste.
+PCMs — often in pad or sheet form, such as the Thermal Grizzly PhaseSheet PTM — start solid at room temperature but soften above approximately 45 °C to fill microscopic gaps like paste. They offer near-paste performance without pump-out or drying, making them suitable for CPUs and GPUs in both laptops and desktops. Electrically non-conductive and durable; initial heat cycles optimise bonding.
-They offer near-paste performance without pump-out or drying, making them suitable for CPUs/GPUs in laptops or desktops.
-Electrically non-conductive and durable, though initial heat cycles optimize bonding.
 ===== Thermal Putty =====
-Thermal putty is a moldable, viscous compound (e.g., Honeywell HT10000, Fehonda TP81) that conforms to uneven surfaces without hardening or drying out.
+Thermal putty is a mouldable, viscous compound (e.g. Honeywell HT10000, Fehonda TP81) that conforms to uneven surfaces without hardening or drying out. It fills variable gaps effectively for GPUs or complex assemblies, providing reliable long-term conductivity better than pads in high-tolerance scenarios. Non-conductive and cost-effective in bulk.
-It fills variable gaps effectively for GPUs or complex assemblies, providing reliable long-term conductivity better than pads in high-tolerance scenarios.
-Non-conductive and cost-effective in bulk, though pricier per gram for premiums.
 ===== Liquid Metal =====
-Liquid metal alloys (e.g., gallium-based) deliver top-tier conductivity (70+ W/mK), outperforming most TIMs for extreme overclocking on CPUs/GPUs.
+Liquid metal alloys (e.g. gallium-based) deliver top-tier conductivity (70+ W/mK), outperforming most TIMs for extreme overclocking on CPUs and GPUs. Because they are electrically conductive, they risk shorts if misapplied — liquid metal is for experienced users only, and must not be used on aluminium surfaces (most CPU heatspreaders are nickel-plated copper, but direct aluminium contact causes alloying). No drying issues, but requires careful application and is not easily reusable.
-Electrically conductive, it risks shorts if misapplied, so it's for experts only on non-aluminum surfaces (most CPU heatspreaders are made of nickel-plated copper, but avoid direct aluminum contact due to alloying).
-No drying issues, but requires careful damming and isn't reusable easily.
-===== Graphite/Graphene Sheets =====
+===== Graphite and Graphene Sheets =====
-Ultra-thin graphite or graphene foils (e.g., Thermal Grizzly Kryosheet) spread heat laterally with high in-plane conductivity, reusable without degradation.
+Ultra-thin graphite or graphene foils (e.g. Thermal Grizzly Kryosheet) spread heat laterally with high in-plane conductivity and are reusable without degradation. They suit flat interfaces such as CPUs, offering paste-like results in tests without the mess of liquids. Electrically conductive — avoid bridging contacts.
-They suit flat interfaces like CPUs, offering paste-like results in tests without liquids.
-Electrically conductive, so avoid bridging contacts; no outgassing issues.
 ===== Other Options =====
-Gap fillers handle large uneven gaps (up to 15mm) across components with high compressibility.
+  * **Gap fillers**: Handle large uneven gaps (up to 15 mm) across components with high compressibility.
-Thermal foils provide durable insulation and conduction for mid-range needs.
+  * **Thermal foils**: Provide durable insulation and conduction for mid-range needs.
-Metal-based TIMs like soft alloys (SMA-TIMs) offer high performance with easier handling than liquid metal.
+  * **Metal-based TIMs (SMA-TIMs)**: Soft alloys offering high performance with easier handling than liquid metal.
+===== TIM Comparison =====
+^ Type ^ Conductivity ^ Ease of use ^ Electrically conductive ^ Reusable ^ Best for ^
+| Thermal paste | Medium–high | Easy | No | No | CPUs, GPUs |
+| Thermal pad | Low–medium | Very easy | No | Yes | VRAM, low-heat components |
+| Phase change material | Medium–high | Easy | No | Yes | CPUs, GPUs (laptops/desktops) |
+| Thermal putty | Medium | Easy | No | Yes | Uneven surfaces, GPUs |
+| Liquid metal | Very high | Difficult | **Yes** | No | Extreme overclocking only |
+| Graphite/graphene sheet | High (lateral) | Easy | **Yes** | Yes | Flat CPU interfaces |
+| Gap filler | Low–medium | Very easy | No | Yes | Large gaps, complex assemblies |
+{{tag>hardware howto cooling thermal}}